5, Mar 2026
KT and Rohde & Schwarz to showcase AI-enhanced radio transmission performance
Mar 05: In a joint 6G AI proof-of-concept demonstration, the CMX500 one-box tester from Rohde & Schwarz shows significant downlink throughput gain in an AI-based wireless transmission compared to conventional non-AI technology. Additionally, the demonstration illustrates how this translates to an enhanced video streaming user experience. This collaboration validates the feasibility of multi-vendor AI interoperability for future 6G standardization.
The CMX500 shows significant downlink throughput gain in an AI-based wireless transmission.
KT has joined forces with Qualcomm Technologies, Inc. and Rohde & Schwarz to present significant performance gains achievable through AI-enhanced radio transmission, paving the way for optimized 5G-Advanced and future 6G networks. Visitors to MWC Barcelona 2026 can experience the demonstration at the KT booth 4A60 in hall 4.
Qualcomm Technologies and Rohde & Schwarz collaborated in 2025 to realize Channel State Information (CSI) feedback technology leveraging AI/ML for advanced mobile networks and RAN infrastructure. The telecommunications company KT, driver of 6G research and AI implementation, now joined the effort to demonstrate the practical benefits of integrating AI into next-generation wireless systems.
In the setup, Qualcomm’s AI-enabled wireless device prototype connected to the CMX500, configured as an AI-enabled base station emulator, achieves an increase in downlink throughput of approximately 50% compared to conventional non-AI technology. Leveraging the advanced application testing capabilities of the CMX500, the demonstration illustrates how the increased performance translates to an enhanced user experience for video streaming applications. The improvement was achieved using a “two-sided AI model” for CSI feedback, enabling cooperative compression of wireless channel state information transferred between the device and base station. The model leverages CSI-RS-based analysis and compressed feedback, significantly enhancing radio transmission performance in massive MIMO scenarios. AI-driven CSI enhancements are expected to result in even greater efficiency, reduced overhead and improved user experience in 5G-Advanced and future 6G networks.
A key achievement of this work is the validation of an interoperable architecture allowing real-time cooperation between AI models from different vendors – a critical step towards 6G standardization and a more open, flexible network ecosystem. The precise and controlled testing environment of the CMX500 one-box tester proves essential for accurately assessing the performance of these sophisticated AI-based algorithms under realistic radio conditions.
Alexander Pabst, Vice President of Wireless Communications at Rohde & Schwarz, said: “We are proud to collaborate with KT and Qualcomm in showcasing the immense potential of AI in next-generation networks. The CMX500’s ability to verify these performance gains underscores our commitment to providing leading-edge test and measurement solutions for the future of communication technologies.”
Lee Jong-sik, Executive Vice President and Head of KT’s Future Network Research Laboratory, said: “6G represents an evolution towards intelligent networks that combine AI and wireless communications rather than simply delivering higher speeds.” He added that KT will continue to secure AI-based wireless technologies that enhance customer experience through strategic partnerships.
Spencer Kim, Vice President and President of Qualcomm Korea, QUALCOMM CDMA Technologies (Korea) YH, noted: “6G will serve as an innovation platform for advanced intelligent edge AI, enabling AI-driven control of network resources. Our collaboration with Rohde & Schwarz and KT marks a critical step in bringing this vision to life and is expected to accelerate progress in next-generation communications.”
At MWC Barcelona 2026, visitors can learn how to achieve significant performance gains through AI-enhanced CSI feedback at the KT booth 4A60 in hall 4.
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- By Neel Achary
5, Mar 2026
Wordly Expands Microsoft Teams Integration with New Enterprise Capabilities
Los Altos, CA – Mar 5 – Wordly announced an enhanced experience for Microsoft Teams, designed to make multilingual collaboration faster, simpler, and more efficient for enterprise teams operating across regions and languages. With a single browser link, employees can view Teams meetings alongside live AI-translated captions, select their preferred language from dozens of options, and follow conversations in real time, without workflow disruption.
Enterprise Benefits:
● Accelerate Global Collaboration: Ensure teams in North America, EMEA, APAC, and LATAM can participate fully without language bottlenecks.
● Coordinate Multilingual Teams: Run briefings, rehearsals, and project alignment sessions so all employees, partners, and stakeholders are on the same page.
● Address Accessibility Requirements: Provide high quality, real-time captions to attendees who need to read live transcripts of meetings.
● Seamless Experience: A single browser link requires no installs or technical training, minimizing IT support.
● Accurate, Speaker-Identified Transcripts: Capture who said what for compliance, documentation, and post-meeting review.
● Enterprise-Grade Security: ISO 27001 certified and SOC 2 Type II compliant, with full administrative control over meeting settings.
● High Quality, Real-time, Affordable: Access to other Wordly features for no extra charge – customizable glossaries to increase accuracy; zero latency to optimize user experience; dozens of languages available on demand.
This update builds on the recently introduced Wordly Workspaces, bringing live translation to everyday meetings with even greater ease. Enterprises can enable live translation when scheduling new meetings or instantly add it to existing sessions, keeping cross-region planning, executive briefings, team standups, and vendor calls running smoothly.
“Enterprise teams face tight timelines and often collaborate across multiple regions and languages,” said Lakshman Rathnam, Founder & CEO of Wordly. “Our Teams translation enhancements allow organizations to run planning meetings, executive briefings, and vendor calls seamlessly in multiple languages. Attendees can access live AI-translated audio and captions alongside Teams video, helping teams collaborate faster, make decisions more efficiently, and ensure every participant is fully engaged.”
Wordly for Microsoft Teams helps enterprises break down language barriers, accelerate decision-making, and scale global collaboration without adding headcount or complexity.
4, Mar 2026
TECNO and Tonino Lamborghini Announce a New International Collaboration
Cairo, Mar 4 — TECNO, the AI-driven innovative technology brand, today at the Mobile World Congress (MWC) announced a new collaboration with Tonino Lamborghini, the Italian lifestyle experience brand renowned for its heritage, boldness and uncompromised spirit. The partnership is born from a shared vision of innovation and modern lifestyle experience.
More than a collaboration, this partnership is an expression of a lifestyle shaped by design, technology and attitude, where Italian aesthetics meet advanced technological innovation to accompany everyday moments with purpose, boldness, and personality.
This collaboration represents a natural evolution for both brands. TECNO reinforces its leadership of merging cutting-edge technology with bold and elegant design through a partnership that conveys character, reliability and high-end user performance. Tonino Lamborghini gains an opportunity to expand into new categories while staying true to its core values of quality, identity and sophistication.
Products developed as part of this collaboration will feature exclusive design elements inspired by Tonino Lamborghini’s iconic style, paired with TECNO’s cutting-edge technological solutions. The result is a refined yet functional offering, designed for an international audience with a strong appreciation for both aesthetics and user experience.
“This partnership is built on the same pursuit of excellence and commitment to their missions. TECNO has shaped the digital experience of hundreds of millions worldwide, and the partnership is another milestone in our relentless journey to reimagine performance and aesthetics,” said Jack Guo, General Manager of TECNO.
“This collaboration brings together two complementary worlds: our design language and TECNO’s technological know-how. Together, we have created a project that interprets contemporary lifestyle with coherence and vision,” commented Dr. Tonino Lamborghini, Founder of Tonino Lamborghini S.p.a.
The first products of the TECNO x Tonino Lamborghini line was officially launched at MWC 2026 Barcelona, marking a new chapter in technology and gaming experiences. The collaboration will extend across gaming devices, mobile phones, laptops, earphones, and tablets, creating a complete smart ecosystem infused with the iconic Tonino Lamborghini design.
Tonino Lamborghini TECNO TAURUS (MEGA MINI G1 Pro)
Tonino Lamborghini TECNO TAURUS (MEGA MINI G1 Pro) is the second generation of TECNO Mini gaming PCs, following the success of the MEGA Mini G1, the world’s first and smallest water-cooling gaming PC. The latest model continues to redefine what a compact gaming system can be, empowering both creative professionals and gaming enthusiasts to harness the full capabilities of the latest applications.
A sleek, all-metal body accented with dazzling RGB lighting highlights the impactful Tonino Lamborghini design and color. The Intel® Core™ i9-13900HK processor boasts an impressive 14 cores and 20 threads, with a clock speed reaching up to 5.4 GHz.
The newly upgraded NVIDIA® GeForce RTX™ 5060 8GB GDDR 7 discrete graphics card boasts 145W of total graphics power. Adopting the NVIDIA Blackwell architecture, it brings game-changing realism of path tracing, cinematic quality visuals at unprecedented speed, ultimate responsiveness and 614 AI TOPS.
The CPU and GPU performance can be monitored via a real-time screen on body, and even in intense computing environments, the mini PC remains silently cool with approximately 10,000mm² pure copper water-cooled cold plate and a triple-fan setup.
Connectivity is equally robust, with 15 ports, WiFi 6E and Bluetooth 5.4. Power is supplied through an external 330W GaN (Gallium Nitride) power adapter.
The device represents the first product line of the TECNO x Tonino Lamborghini collaboration and the next step in high-performance, lifestyle-focused technology.
TECNO POVA Metal Tonino Lamborghini Limited Edition
TECNO POVA Metal Tonino Lamborghini Limited Edition is the world’s first-ever full-metal unibody 5G phone. The phone captures the most distinctive elements of both POVA series and Tonino Lamborghini with uninterrupted curves and an ultra-thin 0.99mm bezel. The Rear Dot Matrix features a 241-pixel independent LED matrix that showcases signature Tonino Lamborghini design elements. It can be personalized to display call alerts, notifications, and other dynamic visuals. Complementing this is a pulse light strip that adds an extra layer of motion and energy to the overall design. Adding to the memorable design is a Snapdragon® processor.
Tonino Lamborghini TECNO AIoT Ecosystem
TECNO also displays a full concept AIoT Ecosystem, which will include laptops, tablets and wearables. Inspired by the iconic aesthetics of Tonino Lamborghini, it features a unified design language marked by sharp geometry and a sleek, modern silhouette. Light in weight and high in performance, the devices will fit users’ daily life for work, creativity, study and daily communications, while fully expressing their individuality.
Mobile World Congress 2026 is from March 2 to 5 in Barcelona, Spain at Fira Gran Via. Visitors may experience the collaboration at the TECNO Booth, located at Stand 7A40, Hall 7.
4, Mar 2026
Samsung India Launches its Most Advanced AI Phone, the Galaxy S26 Series; Pre-order Now for Exciting Offers
GURUGRAM, India – Mar 4 – Samsung, India’s largest consumer electronics brand, announced that its highly-anticipated Galaxy S26 series is available for pre-order in India starting today. The Galaxy S26 Ultra, Galaxy S26+ and Galaxy S26 deliver the most intuitive and natural Agentic AI mobile experiences ever engineered. From managing plans and finding information to capturing and refining content, the Galaxy S26 series reduces the effort required to get things done, allowing users to focus on results rather than how the technology works.
The Galaxy S26 series is designed with Samsung’s most advanced capabilities working together as one: performance, an intuitive camera system and Galaxy AI. This provides a strong foundation that gives Galaxy S26 users the confidence to depend on their phone throughout the day without compromising security or privacy.
Building on Samsung’s decades of innovation in display technology, Galaxy S26 Ultra introduces the industry’s first built-in Privacy Display for mobile phones, reinforcing Samsung’s commitment to privacy at a pixel level. Galaxy S26 Ultra also delivers a customised chipset and upgraded thermal management that enable faster and more powerful AI — all packed in 7.9mm, the slimmest Ultra yet.
“The Galaxy S26 series is designed to understand how people live and work. It marks a new direction for Samsung with Agentic AI that silently handles routine tasks so you can focus on what truly matters: spending time with family, boosting productivity, and enjoying everyday moments. Our engineers from the Bengaluru and Noida R&D facilities have played a pivotal role in its development, and I am proud to share that the Galaxy S26 series will also be manufactured at our factory in Noida,” said JB Park, President and CEO, Samsung Southwest Asia.
Powerful Performance Designed Around Everyday Use
Engineered for all-day performance, the Galaxy S26 series is built on the most powerful hardware ever on a Galaxy S series, engineered for AI performance, power efficiency and thermal management.
On Galaxy S26 Ultra, a customised mobile processor — Snapdragon 8 Elite Gen 5 Mobile Platform for Galaxy — delivers performance gains across CPU, GPU and NPU to support faster, smoother experiences throughout the day. A CPU performance increase of up to 19%, a 39% improvement in NPU performance , and a 24% boost in GPU performance allow users to move between tasks without lag or interruption and boost on-device AI capability
To sustain this level of performance, Galaxy S26 Ultra introduces a redesigned Vapor Chamber with a thermal interface material positioned along the processor, improving heat dissipation to keep the device cool during demanding activities such as gaming, multitasking and video capture. Galaxy S26 Ultra also brings Super-Fast Charging 3.0, reaching up to 75% charge in just 30 minutes.
Embedded into the processor, Samsung’s proprietary ProScaler improves image scaling so photos and videos appear richer and clearer at a glance. Samsung’s mobile Digital Natural Image engine (mDNIe) delivers subtler and more lifelike colours thanks to image processing with four times the precision compared to the previous generation.
Galaxy’s Best Camera System Yet
The Galaxy S26 series integrates content capture, editing and sharing into a seamless experience, making creativity feel natural and accessible without professional tools or technical knowledge.
On Galaxy S26 Ultra, wider camera apertures allow more light to reach the sensor, delivering clearer photos with richer details in low-light conditions. Enhanced Nightography Video keeps footage clearer and more vibrant even in dim scenes, while upgraded Super Steady capabilities make framing easier to achieve, even with bumpy trails or fast-paced activities.
Improvements to the AI ISP now extend to the selfie camera, capturing more natural skin tones and finer detail in mixed lighting. Galaxy S26 Ultra is also the first Galaxy device to support the Advanced Professional Video (APV) standard designed to deliver efficient compression for high-quality production workflows while preserving visually lossless quality even after repeated editing.
Editing photos and videos is streamlined with AI-powered tools so users can make changes quickly without design expertise. With the upgraded Photo Assist suite, users can describe — in their own words — what they want to change; they can add or restore missing parts of images, and even modify outfits in photos. Edits can now be made continuously and adjusted or undone along the way.
Creative Studio brings creation and customisation into one integrated space, enabling users to quickly turn ideas into polished visuals — from stickers and invitations to personalised wallpapers — and share them without interrupting creative flow.
AI-powered tools like Document Scanner remove distortions and distractions such as creases or fingers to deliver clean scans instantly, while multiple images can be organised automatically into a single PDF.
Everyday Ease with Proactive and Adaptive Galaxy AI
The Galaxy S26 series reduces the steps between intent and action by working proactively on the user’s behalf based on context, surfacing the right support at the right moment and automating tasks with minimal manual input.
With Now Nudge, timely and relevant suggestions help users stay in the flow without distraction. Galaxy S26 automatically suggests photos from the Gallery when requested. It recognises Calendar entries when receiving meeting messages and checks for conflicts.
Now Brief becomes more proactive, recommending exercise playlists and surfacing reminders based on personal context. Circle to Search with Google is upgraded with enhanced multi-object recognition so users can explore multiple parts of an image in a single search.
The Galaxy S26 series integrates agents including Bixby, Gemini and Perplexity, enabling tasks to be completed with a single button press or voice prompt. Multi-step actions can be handled in the background, making tasks like booking rides, coordinating actions across apps and controlling device settings easier through natural interaction.
Layers of Protection in the Age of AI
As mobile experiences become more personalised thanks to AI, protecting privacy becomes increasingly critical. Samsung builds protection into every layer of Galaxy S26 while giving users transparency and control over how information is used.
Galaxy S26 Ultra introduces Privacy Display, protecting privacy at the pixel level. By controlling how pixels disperse light, the display keeps content clear for the user while limiting what others can see from side viewing angles.
Users can customise when privacy features turn on — such as when entering PINs and passwords or opening selected apps — and adjust settings depending on the situation. Partial Screen Privacy limits visibility for notification pop-ups, while Maximum Privacy Protection further obscures side views.
AI-powered Call Screening identifies unknown callers and summarises intent, helping users manage calls safely. Privacy Alerts notify users in real time when apps request access to sensitive data so permissions can be managed with clarity and control.
Private Album, built into Gallery, lets users safely hide selected photos and videos. Galaxy S26 also extends post-quantum cryptography (PQC) to critical system processes including software verification and firmware protection. New updates to Knox Matrix further strengthen protection across connected Galaxy devices, adding PQC-enabled end-to-end encryption for direct transfers like eSIM migrations and clearer visibility into firmware update status across the ecosystem through Security Status of Your Devices.
These updates build on Galaxy’s existing security and privacy portfolio which includes Auto Blocker, Theft Protection, Private Sharing, Secure Wi-Fi and more. And with seven generations of OS upgrades and seven years of security updates, Galaxy S26 helps keep these layers resilient over time, supporting longer, more confident use well into the years ahead.
Availability
Pre-order for Galaxy S26 series starts from February 25 across leading online and mainline retailers. Consumers can also pre-order Galaxy S26 series on Samsung Live at www.samsung.com/in/live-offers/ starting today. The Galaxy S26 series features a unified design language across all models, with shared colour options: Cobalt Violet, White, Black and Sky Blue, alongside the Samsung.com exclusive Pink Gold and Silver Shadow.
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4, Mar 2026
AAEON Launches Intelli TWL01 Edge, an Industrial Multimedia PC with Dual 4K Display Support
Featuring dual 4K displays, efficient Intel processing, and flexible mounting options, the Intelli TWL01 Edge marks AAEON UP brand’s entry into the multimedia space.
(Taipei, Taiwan – March 4) AAEON’s UP brand (Stock Code: 6579) has announced the release of the Intelli TWL01 Edge, an Industrial Multimedia PC with dual 4K displays, multiple mounting options, and a range of Intel® Core™ Processor N-series CPUs (formerly Twin Lake).
Built to provide a cost-effective platform for multimedia solution building, the Intelli TWL01 Edge hosts two HDMI 2.0b ports capable of dual simultaneous 4K displays. In addition to this, AAEON notes that the system’s Intel® Processor N-series platform grants users access to both Intel® UHD Graphics and DirectX 12.1 graphics API support, for the purpose of leveraging interactive dashboard functionality, reduced frame latency, and more efficient video rendering for both smaller kiosk and video conferencing suite setups as well as commercial large-scale video walls and interactive billboards.
The Intelli TWL01 Edge is both compact at 152mm x 124.5mm x 39mm and fanless, a design choice driven by market user requests for a system that can be discreetly installed and operate with minimal noise. Moreover, the system offers versatile mounting options, with DIN Rail, VESA, and wall mounting available, allowing the device to be securely mounted in high-vibration settings, clutter-free integration with monitors or kiosks, and even secure media control room cabinets. In the same vein, its environmental specifications make it a relatively safe option for industrial deployment, with a broad 9V to 36V power input range, as well as 8GB of soldered LPDDR5 system memory.
For storage, the Intelli TWL01 Edge comes with 64GB of eMMC. In addition to this, the system offers an M.2 2280 M-Key slot for the integration of high-speed NVMe SSD storage. With this balance, the Intelli TWL01 Edge can maintain local OS storage while leveraging the accelerated read/write performance of external NVMe for large media libraries, faster app launches, and UI responsiveness. Along with its SSD support, the Intelli TWL01 Edge provides an M.2 2230 E-Key slot for Wi-Fi module installation.
The system’s physical I/Os are simple yet robust, with four USB 3.2 Gen 2 Type-A ports, two RJ-45 ports for Gigabit Ethernet, a 10-bit GPIO, and a single COM port for RS-232/422/485.
For OS support, the Intelli TWL01 Edge is compatible with Windows® 11 LTSC, Ubuntu 24.04 LTS, and Yocto 5.1.
3, Mar 2026
AAEON to Demonstrate Next-Gen AI Solutions at NVIDIA GTC
AAEON’s broad line of AI edge solutions powered by NVIDIA technologies will demonstrate the versatile market potential of next-gen AI.
(Taipei, Taiwan – Mar 3) AAEON, an industry-leading provider of edge AI solutions, will present live demonstrations of its extensive line of edge AI solutions powered by NVIDIA Jetson systems-on-module during NVIDIA GTC, the premier global AI conference.
Date: March 16 – 19, 2026
Booth: #149
Venue: San Jose Convention Center, CA
As a sponsor of the conference, which offers over 500 sessions, including panels, talks, and Q&As with industry leaders in the AI space, AAEON highlights upcoming products from its range of products built on NVIDIA Jetson Orin and NVIDIA Jetson Thor, including live demonstrations of its systems at work.
The centerpiece of AAEON’s demonstrations at the event will be a smart vehicle safety application featuring the BOXER-8645AI, illustrating 275 TOPS of inferencing performance available for AI real-time pedestrian and vehicle detection via the tools offered by NVIDIA Jetson AGX Orin module.
Demonstrating AAEON’s use of NVIDIA developer software will be a live demo using the NIKY-2155-NX, AAEON’s first Panel PC powered by NVIDIA Jetson Orin NX, which will run models built using NVIDIA Blueprint for Video Search and Summarization (VSS). This demonstration will illustrate the advances in AI video understanding and interaction, and how they have the potential to revolutionize how we access, analyze, and interact with video content.
AAEON will also host a live demonstration focusing on using compact edge AI to streamline operations in industrial and commercial settings, featuring the upcoming RTC-1210-Nano, a rugged tablet computer powered by NVIDIA Jetson Orin Nano.
Joining AAEON’s live demonstrations will be video demonstrations of collaborative solutions from AI-driven motion capture specialist Red Pill Lab and Yo-Kai Express, a company leading the way in applying physical AI robotics to the restaurant world.
The first of these video demonstrations will illustrate how Red Pill Lab’s multi-camera, multi-actor markerless motion capture software can be executed on AAEON’s MAXER-5100 for animation, VFX, game development and robotics applications.
Meanwhile, a video demonstration from Yo-Kai Express will show a simulation of the company’s autonomous robotics cooking station, powered by the BOXER-8641AI-PLUS, with insights into the impact that key NVIDIA software development tools have had on accelerating the development of the application.
Alongside these live demonstrations, AAEON will have a number of its systems featuring modules from across NVIDIA Jetson Orin and NVIDIA Jetson Thor lineup on display, including the BOXER-8740AI and BOXER-8741AI from AAEON’s Embedded Box PC range and the MAXER-5000, an AI Inference Server, all of which are powered by NVIDIA
Jetson T5000 module.
Also on show will be the BOXER-8649AI, an IP67-rated fanless embedded Al system powered by NVIDIA Jetson AGX Orin.
“We are incredibly excited to be exhibiting at NVIDIA GTC, which will give us the opportunity to showcase the work we are doing as the next wave of AI innovation begins,” said Alex Hsueh, Associate Vice President of AAEON’s Smart Platform Business Unit. “We also look forward to providing visitors with a clear picture of how we are adopting NVIDIA’s transformative technologies, and how they can be deployed in new and exciting ways,” Hsueh added.
3, Mar 2026
MWC 2026: Amdocs Collaborates with Microsoft to Bring AI-Accelerated Application Modernization to Enterprises
MWC 2026: Amdocs Collaborates with Microsoft to Bring AI-Accelerated Application Modernization to Enterprises
Joint collaboration combines the Amdocs’ Agentic Services, as part of Amdocs agentic operating system, aOS, with Microsoft’s AI technologies to help enterprises modernize faster, at scale, and with greater resilience.
Amdocs delivers its cloud migration, modernization, and quality engineering expertise through its multivendor Amdocs Agentic Services, which includes Microsoft technologies like Microsoft Foundry (including Azure Open AI in Foundry Models), Microsoft Migration Agents, GitHub Copilot and Fabric IQ. Enterprises can deploy a coordinated set of Amdocs and Microsoft IT agents that automate and orchestrate end-to-end modernization activities, enabling accelerated refactoring, strengthened architectural resilience, and seamless migration to Microsoft Azure.
At the core of the solution is Amdocs Agentic Services, part of the Amdocs agentic operating system (aOS), which orchestrates specialized agents from across Amdocs Studios into coordinated, multi-agent workflows. Delivered through a growing library of pre-built, customizable workflows, the agentic services operationalizes AI across modernization initiatives at scale. This scalable model simplifies execution, enhances quality and consistency, and delivers measurable business outcomes with full observability and control.
“This collaboration with Microsoft marks a pivotal step forward in shaping how enterprises modernize at scale,” said Anthony Goonetilleke, Group President of Technology and Head of Strategy at Amdocs. “Powered by Amdocs aOS, with AI embedded at the core of execution, we are reimagining modernization as an agent-led, intelligently orchestrated process that helps organizations address technical debt and achieve enterprise-grade speed and efficiency.”
“Enterprises today are looking for practical, scalable ways to modernize their applications while minimizing risk and disruption,” said Rick Lievano, Worldwide CTO, Telco, Media & Gaming at Microsoft. “By combining Microsoft’s AI capabilities with Amdocs’ deep modernization expertise to deliver Service-as-Software, this collaboration empowers customers to accelerate their cloud journeys on Microsoft Azure with greater confidence, speed, and efficiency.”
Amdocs and Microsoft will share more about how they are collaborating to drive innovation at Mobile World Congress (MWC) 2026, the world’s largest telco conference. Amdocs will demonstrate its cloud transformation-specialized agents at its partner demo corner pods at the booth, and Microsoft will showcase the solution at its booth.
3, Mar 2026
HANMI Semiconductor Deepens Strategic Partnership with Micron at India ATMP Facility’s Opening Ceremony
Director Jong-Jin Lee and Executive Vice President Myung-Ho Lee of HANMI Semiconductor attended the grand opening ceremony of Micron’s first semiconductor manufacturing facility in India on February 28. During the event, HANMI Semiconductor received a commemorative plaque for DDR5 DRAM produced in India from Micron Chairman and CEO Sanjay Mehrotra.
SEOUL, South Korea (Mar 3) — HANMI Semiconductor today announced that it attended the grand opening ceremony of Micron Technology’s semiconductor facility in Sanand, Gujarat, India, on February 28. The facility marks Micron’s first semiconductor manufacturing plant in India.
The inauguration ceremony was attended by Indian Prime Minister Narendra Modi, who delivered a commemorative address, along with senior government officials, Micron Chairman and CEO Sanjay Mehrotra, and other key executives.
HANMI Semiconductor was invited as a key equipment supplier to Micron’s India facility, reaffirming its position as a key strategic partner.
Micron’s plant in India is an advanced packaging facility backed by a total investment of USD 2.75 billion and supported by financial incentives from the Government of India. Aimed at strengthening the country’s semiconductor industry, the project has been designated as a national strategic initiative, with the Government of India providing 50% of the investment in subsidies and the State of Gujarat contributing an additional 20%. The facility is expected to serve as a strategic hub for testing and packaging high-performance AI memory products, including multi-die GDDR (Graphics DRAM) and enterprise SSDs (stacked NAND Flash).
The DDR5 DRAM currently being produced in Gujarat, India, is based on Micron’s most advanced DRAM technology, utilizing its latest 1-gamma process node. Micron announced that it plans to begin packaging and testing tens of millions of chips this year, with production expected to scale to hundreds of millions next year. Accordingly, it is expected that KRW 2 trillion (approximately USD 1.4 billion) will be invested in advanced semiconductor packaging equipment, including TC bonders used for stacking AI memory semiconductor chips.
The facility also holds historic significance as the first project approved under the “India Semiconductor Mission 2.0” and as the first semiconductor manufacturing facility established in the country. It is widely regarded as a major milestone in India’s advancement toward becoming a key hub in the global semiconductor supply chain. Through the initiative, the government has introduced an incentive program of approximately USD 10 billion to advance the country’s ambition of becoming a global semiconductor manufacturing hub.
Advanced bonding technology and rapid technical support are critical to ensuring the stable operation of the new facility. As a core supplier to Micron, HANMI Semiconductor plans to fly in engineers to India to provide on-site technical support and operate training programs, reinforcing its long-term strategic collaboration. Building on this partnership, the company received the “Outstanding Supplier Performance Award” from Micron in 2025.
“HANMI Semiconductor’s participation in Micron’s grand opening of semiconductor facility in India and the roundtable reaffirms our position as a key supplier in the global semiconductor supply chain,” said a HANMI Semiconductor official. “As Micron’s key supplier, we will continue to dispatch engineers to India and provide close technical support to ensure the highest level of customer satisfaction.”
2, Mar 2026
Tenable Research Reveals Growing AI Exposure Gap Fueled by Supply Chain Risks and Lack of Identity Controls
Dubai, UAE. – (Mar 2) – Tenable® (NASDAQ: TENB), the exposure management company, today released its Cloud and AI Security Risk Report 2026. The research reveals organizations face a zero‑margin AI exposure gap as they inherit cyber risks faster than they can address them. Engineering velocity — driven by AI adoption, third-party code and cloud scale — has outpaced the human-led ability to assess, prioritize and remediate risks before threat actors exploit them.
The AI Exposure Gap is a largely invisible form of exposure that emerges across applications, infrastructure, identities, agents and data, and that most security teams are not equipped to manage. Tenable’s analysis of cloud environments identifies severe risks across four key security areas: AI security posture, supply chain attack vectors, least privilege implementation and cloud workload exposure — all of which demand immediate attention. The report includes actionable guidance for security and business leaders to reduce risk across cloud and AI environments.
Key findings from the Cloud and AI Security Risk Report 2026 include:
● 70% have integrated at least one AI or Model Context Protocol (MCP) third-party package, embedding AI deep into applications and infrastructure, often without central security oversight.
● 86% host third-party code packages with critical-severity vulnerabilities, making the software supply chain a primary and persistent source of cloud exposure. Furthermore, nearly 1 in 8 (13%) have deployed packages with a known history of compromise, such as the s1ngularity or Shai-Hulud worms.
● 18% of organizations have granted AI services administrative permissions that are rarely audited, creating a “pre-packaged” catalog of privileges for attackers to claim.
● Non‑human identities such as AI agents and service accounts now represent higher risk (52%) than human users (37%), forming “toxic combinations” of permissions and access that fragmented tools fail to connect.
● 65% possess “ghost” secrets—unused or unrotated cloud credentials—with 17% of these tied specifically to critical administrative privileges.
● 49% of identities with critical-severity excessive permissions are dormant.
“AI systems embedded in infrastructure pose a critical risk that CISOs and defenders must address, in addition to anticipating emerging threats from both AI and cloud technologies. Lack of visibility and governance means teams are at the mercy of new exposures, including over-privileged identities in the cloud,” said Liat Hayun, Senior Vice President of Product Management and Research at Tenable. “By focusing on the unified exposure path, organizations can stop managing ‘security debt’ and start managing actual business risk.”
To manage emerging risks, organizations must secure the AI integration process through comprehensive visibility and identity-centric controls. This includes enforcing least privilege for AI roles, neutralizing “ghost” identity risk and eliminating static secret exposure. Third-party code and external accounts are now extensions of organizations’ infrastructure; steps to reduce extended supply chain exposure include unifying visibility across code packages, virtual machines, identity access and cloud environments.
The 2026 Cloud & AI Security Risk Report presents findings from the Tenable Research team, analyzing anonymized telemetry from diverse public cloud and enterprise environments collected from April to October 2025 (AI findings extended through December 2025).
Exposure Management is the practice of identifying, evaluating, and prioritizing the risks posed by all entry points an attacker could exploit. This includes not just software vulnerabilities (CVEs), but also misconfigurations, excessive user privileges (identity risk), cloud security gaps, and the “shadow” assets created by AI and third-party supply chains.
2, Mar 2026
Rohde & Schwarz demonstrates FR1–FR3 carrier aggregation, advancing 6G readiness
Mar 2: Rohde & Schwarz and Qualcomm Technologies, Inc. have reached another pivotal milestone in 6G research and ecosystem readiness, successfully demonstrating carrier aggregation across FR1 and FR3 frequency ranges. The joint achievement is showcased live at MWC Barcelona 2026.
The CMX500 one box tester is ready for 6G research with the new modular RFU18 board.
At MWC Barcelona, Rohde & Schwarz and Qualcomm Technologies present a live demonstration at the Rohde & Schwarz booth (5A80) that aggregates a mid-band channel around 2.5 GHz (FR1) with an upper mid-band channel around 7 GHz (FR3), using 4×4 MIMO on both bands and higher-order modulation. With this setup, the two companies validate end-to-end device behavior across the aggregated spectrum.
At the heart of the test setup is the CMX500 one-box signaling tester from Rohde & Schwarz, extended with the new RFU18 board to provide coverage up to 18 GHz. RFU18 is a modular hardware upgrade for the CMX500 platform, giving customers a straightforward, cost-effective path to extend existing testers towards 6G. As device under test (DUT), Qualcomm Technologies provided a Mobile Test Platform (MTP) powered by the Qualcomm® Modem-RF System, enabling comprehensive validation of RF performance and protocol behavior across the aggregated FR1 and FR3 bands.
The FR3 frequency range (7.125 to 24.25 GHz) has been identified by industry and research as a “sweet spot” for combining wide-area coverage with high capacity. FR3 in terrestrial networks (TN) and non-terrestrial networks (NTN) is expected to support demanding applications such as eXtended Reality (XR), connected and autonomous vehicles and industrial automation. By validating FR3 as an additional frequency range for future networks, the partners are helping accelerate 6G development and ecosystem readiness.
Goce Talaganov, Vice President Mobile Radio Testers at Rohde & Schwarz, said: “Through our ongoing collaboration with Qualcomm Technologies, we continue to push the boundaries of wireless communications. As the ecosystem moves toward 6G, we’re showing how easy innovation can be with our test equipment. In response to customer demand, we are extending the CMX500 platform to 18 GHz – so that our customers gain headroom for FR3 evolution and higher-frequency emissions and harmonic testing.”
Tingfang Ji, Vice President of Engineering and Head of 6G Research at Qualcomm Technologies, Inc. said: “Our collaboration with Rohde & Schwarz highlights the importance of aggregating existing spectrum bands with new 6G spectrum in FR3 to establish 6G as the high efficiency digital infrastructure for the 2030s. By validating new spectrum layers and advanced RF capabilities using our MTP powered by Qualcomm Modem-RF System, we are accelerating innovation across the ecosystem and helping prepare devices and networks for the next-generation of services.”
Future-ready CMX500 platform for 6G:
The CMX500 is a modular, powerful and future-proof one-box signaling tester enabling comprehensive multi-technology testing – from RF to protocol – across all relevant frequency ranges (FR1, FR2 and FR3). All existing CMX500 platforms can be enhanced with the new RFU18 board to extend frequency coverage and capabilities without replacing the entire system, offering users a simple upgrade path.
Engineered for data rates up to 20 Gbps, the CMX500 is one of the most versatile mobile device test platforms, supporting wide dynamic range, 4096QAM and up to 16 device antenna ports for advanced spatial multiplexing. With its multi-band capabilities, it covers LTE and NR in SA/NSA modes, NR-NTN, NB-NTN, Direct-to-Cell (D2C/DTC) testing, and WLAN including Wi‑Fi 7 and future Wi‑Fi 8.
Visitors to MWC Barcelona 2026 can experience the joint demo of FR1–FR3 carrier aggregation at the Rohde & Schwarz booth 5A80 in hall 5 from March 2 to 5, 2026, and can learn from the company’s experts how the CMX500 platform with RFU18 enables faster 6G device and network innovation.
